Summary:
UK company that specializes in the sealing and protection of electronics using low pressure injection moulding technology offers this technology to partners either under a licensing ageement or commercial agreement with technical assistance.
Description:
The UK family-run company was established in 2016.
The company specializes in moulding directly on to electronic assemblies, including PCBs (printed circuit boards), sensors and other sensitive components including LiPo and other batteries, providing a totally sealed and encapsulated product.
Low pressure injection moulding is a faster, cleaner and lower cost alternative to encapsulation. The process is non-toxic, a great advantage when compared to potting with epoxies and or urethanes.
Low Pressure Injection Moulding is a three-step process rather than an eight step process for potting. This removal of process steps reduces manufacturing time, labour and material costs and improves throughput, resulting in increased return on investment.
The company is offering equipment and a moulding solution for the electronics encapsulation and overmoulding services and expertise in how to use this equipment for the production of prototypes and low-volume production parts which can take a product from the design stage through to production. It is seeking partners under either a licensing agreement or alternatively a commercial agreement with technical assistance.
Type (e.g. company, R&D institution…), field of industry and Role of Partner Sought:
The company would like to work with prospective partners who are ideally electronics manufacturers looking to incorporate the innovative moulding technology into their production processes either under a commercial agreement with technical assistance or under a licensing agreement whereby the partner works under the company branding.
Stage of Development:
Already on the market
IPR Status:
Secret Know-how,Copyright,Other
External code:
TOUK20210326001
